New Ultra-Compact CSP MOSFET for General Switching Applications
14. November 2025 | Planegg
Nuvoton has released a new high-performance CSP MOSFET solution designed for wearable and compact electronic devices, uniting small size, high efficiency, and reliability.
With a 0.6 × 0.6 mm form factor, this MOSFET enables ultra-compact designs without compromising power performance. The on-resistance of only 14.0 mΩ, ensuring low power consumption and extended battery life, makes it ideal for next-generation wearables and portable electronics.
Additionally, the device offers exceptional reliability with a failure rate of just 1/30 in comparison to standard mold resin packages (based on Nuvoton QA records).
This combination of miniaturization, energy efficiency, and durability makes Nuvoton’s new MOSFET a key component for design-in projects requiring optimal performance in space-constrained applications.
Q&A
What makes Nuvoton’s new CSP MOSFET ideal for wearable devices?
Its ultra-compact 0.6 × 0.6 mm package enables space-saving designs, while maintaining high power performance — making it perfect for wearables and portable electronics.
How does the device contribute to energy efficiency?
With an extremely low On-resistance of 14.0 mΩ, the MOSFET ensures minimal power loss, leading to lower power consumption and extended battery life in mobile applications.
What reliability advantages does this MOSFET offer?
The CSP MOSFET achieves a failure rate only 1/30 that of standard mold resin packages (based on Nuvoton QA data), providing enhanced reliability for mission-critical and long-lifecycle designs.
